Nanoindentation and Adhesion Properties of Ta Thin Films
نویسندگان
چکیده
منابع مشابه
architecture and engineering of nanoscale sculptured thin films and determination of their properties
چکیده ندارد.
15 صفحه اولFracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation
The semiconductor industry is gradually moving from well-established AlySiO technology to the new Cuylow-k interconnects, 2 which brings a challenge in terms of poor thermal andyor mechanical properties of low-K dielectric films. Extensive nanoindentation studies have been undertaken on organo-silicate glass (OSG) low-K films to explore their mechanical and fracture properties. A cube corner in...
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ژورنال
عنوان ژورنال: Journal of Nanomaterials
سال: 2013
ISSN: 1687-4110,1687-4129
DOI: 10.1155/2013/154179