Modeling Nanocrystalline Grain Growth during the Pulsed Electrodeposition of Gold-Copper
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چکیده
منابع مشابه
Pulsed Electrodeposition of Copper
Pulsed electrolysis of copper has been systematically investigated by electrodepositing copper from a copper sulfate bath. Pulse duty cycles of 5 to 80 percent, at frequencies from 10 to 100 Hz with current densities ranging from 2.5 to 7.5 A/dm2 were employed. The appearance of Hull Cell panels with both direct current and pulsed current was recorded. The influence of pulsed current on current...
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The texture evolution accompanied by grain growth was investigated in a nanocrystalline Fe-78wt%Ni alloy, namely permalloy fabricated by using an electrodeposition method. The as-deposited specimen revealed a strong <100>//ND and a weak <111>//ND fibre-type textures. Grain growth took place during annealing beyond 370°C and resulted in the texture change such that the <111>//ND fibre strongly d...
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The microstructure evolution (crystallite size and microstrain) as well as the residual stress of Cu thin films of various thicknesses (250 nm, 500 nm and 1 ìm) on passivated Si substrates during isochronal annealing was investigated by in-situ X-ray diffraction measurements in the temperature range between 25°C and 250°C. Before annealing, the thermoelastic behaviour was investigated excluding...
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Evolution of microstructure morphologies and grain orientations of Cu-Cu bonded wafers during bonding and annealing were studied by means of transmission electron microscopy, electron diffraction and X-ray diffraction. The bonded Cu grain structure reaches steady state after post-bonding anneal. An abnormal (220) grain growth was observed during the initial bonding process. Upon annealing, the ...
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ژورنال
عنوان ژورنال: ECS Transactions
سال: 2019
ISSN: 1938-6737
DOI: 10.1149/1.2214579