Microstructure and properties of a vacuum-tempered glass with low-temperature-sintered silver paste

A low-temperature sintered silver paste was used for the metallization of tempered glass, which to prepare vacuum-tempered glass by soldering with Sn96.5Ag3Cu0.5 (SAC305). The effects content and sintering temperature on microstructures, shear strengths, fracture mechanisms bondlines were investigated in detail. microstructure thick film its interface characterized. dissolution precipitation behaviors Bi–B–Zn also analyzed. Bi4B2O9 crystals detected when joining increased above 450 °C, can strengthen glass. After at °C 10 min, an excellent bondline formed using paste, had a strength 42.3 ± 2.4 MPa leak rate 7.2 0.4 × 10–3 Pa.cm3/s. composition 80 wt.% 20 powder. Furthermore, heat transfer tests revealed that vacuum thermal insulation properties. results showed combined effective method