Microfabrication and Plating. Microbump Formation Using Electroplating or Electroless Plating.
نویسندگان
چکیده
منابع مشابه
Formation of Au Microbump Arrays for Flip-Chip Bonding Using Electroless Au Deposition from a Non-Cyanide Plating Bath
The formation of Au microbump arrays for flip-chip bonding was investigated using an electroless Au plating bath. Generally, electroless Au deposition gives a low deposition rate, preventing the fabrication of Au bumps with heights of more than 5 μm. To overcome this problem, we developed a new electroless Au deposition process that employs a non-cyanide bath. This process delivers a high depos...
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ژورنال
عنوان ژورنال: Journal of the Surface Finishing Society of Japan
سال: 1995
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.46.775