Mechanical Properties of Low Temperature and Fast Cure Epoxy with Various Mercaptans

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Cure progress in epoxy systems: dependence on temperature and time

We have developed an analytical formula for the cure progress of epoxy systems as a function of both time t and temperature T. Complex viscosity h* or the storage modulus G' are used as the measures of the cure progress. The equation is based on the shape of the isothermal viscosity vs. time curves typically found for thermoset systems; temperature dependence of the isothermal parameters is est...

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Epoxy – Polysulfide copolymers without or with low amounts of epoxy in their structure have poor mechanical properties in oxidative curing system.To strengthen the mechanical properties of polysulfide elastomer inclusion of epoxy resin (Epon828) as hard segment was studied. FT-IR spectroscopy and rheometry were used to verify the formation of epoxy-polysulfide copolymer.  Results obtained f...

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Viscoelastic Properties of an Epoxy Resin during Cure

The cure dependent relaxation modulus of an epoxy resin was investigated over the entire range of cure extent. Parallel plate rheometry was used to measure the material behavior below the gel point of the epoxy network. Creep testing in three-point bend was used for specimens cured past gelation. All data were converted to the stress relaxation modulus for comparison of the material behavior am...

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Fast Mux-based Adder with Low Delay and Low PDP

Adders, as one of the major components of digital computing systems, have a strong influence on their performance. There are various types of adders, each of which uses a different algorithm to do addition with a certain delay. In addition to low computational delay, minimizing power consumption is also a main priority in adder circuit design. In this paper, the proposed adder is divided into s...

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ژورنال

عنوان ژورنال: Polymer Korea

سال: 2013

ISSN: 0379-153X

DOI: 10.7317/pk.2013.37.5.557