Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors

Metal-oxide (MOX) gas sensors commonly rely on custom packaging solution. With an ever-increasing demand for MOX sensors, there is a clear need low cost, compact and high-performance package. During normal operation, are heated up to temperature in the typical range of 200-300°C. However, generated heat must not damage or degrade any other part assembly. Using 3D finite elements modelling, we developed optimal package configuration. To thermally insulate assembly from sensor have in-house thermal conductivity xerogel-epoxy composite with 22.7% by weight xerogel 107.9 mW m −1 K which reduction exceeding 30% compared commercially available epoxy. Based composite, novel approach that can suit large family sensors. The alternative solution includes small number steps uses standard processes techniques. assembled cost has power consumption, while all sensitive parts remain at during system’s lifetime.