Lead Free BGAs Soldered with SnPb36Ag2 Solder
نویسندگان
چکیده
منابع مشابه
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size, Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array (LGA) and Ball Grid Array (BGA) technology with 0.254, 0.30, and 0.40mm diameter SAC305 solder balls was performed. The devices were subjected to three thermal cycle conditions in order to promote 2nd level solder fatigue. Failure data was compared using Weibull analyses. The ...
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Board-level drop impact testing is a useful way to characterize the drop durability of the different soldered assemblies onto the printed circuit board (PCB). The characterization process is critical to the lead-free (Pb-free) solders that are replacing lead-based (Pb-based) solders. In this study, drop impact solder joint reliability for plastic ball grid array (PBGA), very-thin quad flat no-l...
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ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2015
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.mi201409