Lead Free Assemble Technology by Conductive Adhesive.

Lead Free Conductive Composites for Electrical Interconnections

Thermal Conductivity Performance Modeling and Characterization of a Novel Anisotropic Conductive Adhesive Used in Lead-free Electronics Packaging

The continued desire to utilize an alternative to leadbased solder materials for electrical interconnections has led to significant research interest in Anisotropic Conductive Adhesives (ACAs). The use of ACAs in electrical connections creates bonds using a combination of metal particles and epoxies to replace solder. The novel ACA discussed in this paper allows for bonds to be created through ...

Screening Life Cycle Assessment of Silver-Based Conductive Adhesive vs. Lead-Based Solder and Plating Materials

Conductive adhesives are getting growing attention in the electronics industry as they constitute an alternative to lead-free solders and conventional solders. The purpose of the present research is to compare the 10Sn90Pb solder paste to an epoxy based isotropically conductive adhesive (ICA) containing pure silver. The study is done from a life cycle perspective in Japan using input data from ...

Direct Printing of 1-D and 2-D Electronically Conductive Structures by Molten Lead-Free Solder

This study aims to determine the effects of appropriate experimental parameters on the thermophysical properties of molten micro droplets, Sn-3Ag-0.5Cu solder balls with an average droplet diameter of 50 μm were prepared. The inkjet printing parameters of the molten micro droplets, such as the dot spacing, stage velocity and sample temperature, were optimized in the 1D and 2D printing of metall...

Adhesive and Conductive – Inkjettable nano-filled inks for use in microelectronics and microsystems technology

Current technology, Inkjet is an accepted technology for dispensing small volumes of material (50 – 500 picolitres). Currently traditional metal-filled conductive adhesives cannot be processed by inkjetting (owing to their relatively high viscosity and the size of filler material particles). Smallest droplet size achievable by traditional dispensing techniques is in the range of 150 μm, yieldin...