LCA of Manufacturing Lead-Free Copper Alloys

A Test Methodology for Copper Dissolution in Lead-Free Alloys

Lead-free selective soldering can result in extended times at high temperatures, which in turn can result in excessive dissolution of exposed copper, such as plated through holes. This phenomenon is more severe with lead-free, since the alloys have higher melting points, hence requiring longer times for the PTH to reach the higher temperatures, and the alloys typically have a greater capacity t...

Lead-Free Wrought Copper Alloys for Bushings and Sliding Elements

Challenges in Manufacturing Reliable Lead Free Components

The recent push for lead free products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment are requiring materials that consistently withstand peak reflow temperatures of 240?C to 260°C. Reflow soldering at these ext reme temperatures, especially after extended moisture exposure, introduces several challenges that must be solved to produce reliable ...

A Comparison of Tin-Silver-Copper Lead-Free Alloys Practical Guide to Achieving Lead-Free Electronics Assembly Materials & Process Considerations for Lead-Free Assembly Lead-Free Solder Assembly for Mixed Technology Circuit

As the electronics industry begins to focus upon the tin-silver-copper family of alloys as a viable replacement for tin-lead solders, research needs to be done to determine if any particular alloy is best suited for the broadest range of applications. The tin-silver-copper family of alloys has earned a great deal of positive response from various industry consortia and organizations in recent y...

Board Level Reliability Comparison of Lead Free Alloys

Board level reliability testing was used to compare six lead free alloys to tin-lead eutectic using a 98 ball Wafer Level Chip Scale Package (WLCSP). The component had a 0.5mm Ball Grid Array (BGA) pitch, and Al/NiV/Cu pad metallization. Thermal cycling (4 conditions), cyclic bend (2 conditions), cyclic drop (3 conditions), and solder joint array tensile testing (3 conditions) were utilized to ...