Latest Exposure Technology in Semiconductor Package Process
نویسندگان
چکیده
منابع مشابه
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the ...
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ژورنال
عنوان ژورنال: Journal of The Japan Institute of Electronics Packaging
سال: 2018
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.21.193