Joining of Graphite and Aluminum Nitride Ceramics by using CBC Interlayer
نویسندگان
چکیده
منابع مشابه
Joining Ceramics to Metals using Metallic Foam
A general method for brazing ceramics to metals using a compliant metallic foam as a buffer layer has been developed. Using stainless steel foams, bonds between alumina and 316 stainless steel with shear strengths up to 33 MPa have been achieved. The resultant ductility enhances the resistance of the joint to thermal cycling; AlN-Inconel 600 bonds exhibited good thermal shock resistance. Alumin...
متن کاملan investigation into translation of cultural concepts by beginner and advance student using think – aloud protocols
this research aims at answering the questions about translation problems and strategies applied by translators when translating cultural concepts. in order to address this issue, qualitative and quantitative study were conducted on two groups of subjects at imam reza international university of mashhad. these two groups were assigned as beginner and advanced translation students (10 students). ...
Graphite and Hexagonal Boron-Nitride have the Same Interlayer Distance. Why?
Graphite and hexagonal boron nitride (h-BN) are two prominent members of the family of layered materials possessing a hexagonal lattice structure. While graphite has nonpolar homonuclear C-C intralayer bonds, h-BN presents highly polar B-N bonds resulting in different optimal stacking modes of the two materials in the bulk form. Furthermore, the static polarizabilities of the constituent atoms ...
متن کاملSynthesis of Boron-Aluminum Nitride Thin Film by Chemical Vapour Deposition Using Gas Bubbler
Boron included aluminium nitride (B-AlN) thin films were synthesized on silicon (Si) substrates through chemical vapour deposition ( CVD ) at 773 K (500 °C). tert-buthylamine (tBuNH2) solution was used as nitrogen source and delivered through gas bubbler. B-AlN thin films were prepared on Si-100 substrates by varying gas mixture ratio of three precursors. The structural properties of the films ...
متن کاملInvestigating the Joining of Ni3Al Intermetallic Compound, using Transient Liquid Phase (TLP) Method with Cu Interlayer
In this study, joining of Ni3Al intermetallic compounds using the transient liquid phase (TLP) process with Cu interlayer was investigated. The binding process was carried out in a vacuum furnace at a temperature of 1050 °C for different times of 30, 60, 90 and 120 minutes. The effect of time variation on microstructure and mechanical properties of the joint zone was investigated. The EDS analy...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of the Japan Society of Powder and Powder Metallurgy
سال: 2011
ISSN: 0532-8799,1880-9014
DOI: 10.2497/jjspm.58.686