Investigations of void collapse in nanoporous Cu by molecular dynamics simulations
نویسندگان
چکیده
Mechanical responses of nanoporous Cu samples under various loading conditions are investigated by molecular dynamics simulations. Effects mode, initial void size, temperature, and distribution analyzed. The simulations show that the collapse time uniaxial compression is about three times triaxial compression, rate increases as temperature rises. Dislocation nucleation found to stimulate void. For with a single void, final dislocation density lower than which due accumulation greatly slows down after fully collapsed. multiple voids, much faster resulting in higher compression. Irrespective evolutions stress volume fraction remain invariant when fixed; however, decreases radius increases.
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ژورنال
عنوان ژورنال: AIP Advances
سال: 2023
ISSN: ['2158-3226']
DOI: https://doi.org/10.1063/5.0153661