Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates

Cu-based alloys are one of the most promising substrates to enhance performance lead-frame materials. In present study, interfacial reactions in Sn-0.7 wt.% Cu (SC) lead-free solder reacting with Cu-3.3 Fe (C194), Cu-2.0 Be (Alloy 25), and Ti (C1990 HP) were investigated. The material underwent a liquid–solid interface reaction, reaction time was 0.5 few hours at temperatures 240 °C, 255 270 °C. morphology, composition, growth rate, mechanism intermetallic compounds (IMCs) formed investigated this study. results showed that couples SC/C194, SC/Alloy 25, SC/C1990 HP IMCs, which [(Cu, Fe)6Sn5 (Cu, Fe)3Sn], Be)3Sn Be)6Sn5], [Cu6Sn5] phases, respectively. Finally, IMC for displayed control, grain boundary diffusion