Investigation of model parameters of lead-containing and lead-free solders
نویسندگان
چکیده
منابع مشابه
Novel Rare-Earth-Containing Lead-Free Solders with Enhanced Ductility
Several lead-free material systems are available as replacements for traditional lead-based solders in microelectronic packaging, including near-eutectic combinations of tin-rich alloys. Although these materials have superior mechanical properties as compared to the Pb-Sn system, much work remains in developing these materials for electronic packaging. Small additions of rare-earth elements hav...
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T he use of lead in the electronics industry today accounts for approximately 7% of total lead consumption.' The single largest use of lead is in the manufacture of storage batteries, which accounts for 60% of the total lead produced.2 The use of lead is closely regulated in plumbing, paint and gasoline industries. Currently, the electronics industry has been exempted from the existing requirem...
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Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders
In this paper we will demonstrate how a thermodynamic-kinetic method can be utilized to rationalize a wide range of interfacial phenomena between Sn-based lead-free solders and Ni metallizations. First, the effect of P on the interfacial reactions, and thus on the reliability, between Sn-based solders and electroless Ni/immersion Au (ENIG) metallizations, will be discussed. Next, the effect of ...
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ژورنال
عنوان ژورنال: PAMM
سال: 2002
ISSN: 1617-7061,1617-7061
DOI: 10.1002/1617-7061(200203)1:1<179::aid-pamm179>3.0.co;2-o