Intermetallic Phase Growth and Reliability of Sn-Ag-Soldered Solar Cell Joints

The Kinetics of Formation of Ternary Intermetallic Alloys in Pb-Sn and Cu-Ag-Sn Pb-free Electronic Joints

A simple model of the formation of Au0.1Ni0.1Sn0.8 in Pb-Sn solder/Ni interconnects is examined by numerical simulation. Previous experimental observation has shown that after reflow the interface consists of the Ni3Sn4 alloy between Pb-Sn solder and Ni, with Au distributed through the PbSn solder ball. Au0.1Ni0.1Sn0.8 was observed to form at the Pb-Sn solder/Ni3Sn4 interface during annealing a...

High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy for packaging of interconnects in the electronics industry, and highAg-content SAC alloys are the most popular choice. However, this choice has been encumbered by the fragility of the solder joints that has been observed in drop testing as well as the high cost of the Ag itself. Therefore, low-Ag-content SAC all...

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

Purpose – The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints. Design/methodology/approach – A four-factor factorial design with three replications is selected in the experiment. The input variables are the peak temperature, the dur...

Effects of Intermetallic Morphology at the Metallic Particle/Solder Interface on Mechanical Properties of Sn-Ag-Based Solder Joints

Mechanical incorporation of metallic particles in the Sn-Ag-based solder re­ sulted in various intermetallic compound (IMC) morphologies around these particles during reflow. Unlike with the Ni particles, the IMCs formed around Cu and Ag particles are relatively insensitive to reflow profiles employed. The IMC formed around the Ni particles ranges from “sunflower” morphology to “blocky” morphol...

Electron microscopy of gold soldered joints.