Interlayer Investigations of GaN Heterostructures Integrated into Silicon Substrates by Surface Activated Bonding

نویسندگان

چکیده

Thinning the buffer layer thickness between GaN epilayer and Si substrate without introducing large residual stress is persistently desired for GaN-on-Si devices to promote their thermal budgets low-cost, multifunctional applications. In this work, heterostructures were directly bonded at room temperature by surface activated bonding (SAB) therein states investigated confocal micro-Raman. The effects of annealing process on interfacial microstructure in SAB fabricated also systematically situ micro-Raman transmission electron microscopy. It was found that a significant relaxation more uniform distribution obtained heterostructure comparison with MOCVD grown sample; however, increasing temperature, stresses evolute monotonically different trends. main reason can be ascribed amorphous formed interface, which played critical role transformed into much thinner crystallized interlayer any observable structural defects after 1000 °C annealing.

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ژورنال

عنوان ژورنال: Crystals

سال: 2023

ISSN: ['2073-4352']

DOI: https://doi.org/10.3390/cryst13020217