منابع مشابه
Thermodynamics and Kinetics of Oxidation and Temperature Dependent Mechanical Characterization of Pure Indium Solder
MicroElectroMechanical System (MEMS) devices often require low-temperature, fluxless soldering techniques due to their high temperature sensitivity and the performance requirements of specific components. While seeking the development of a soldering technology using pure indium, the major focus of this study is to assess the thermodynamics and kinetics of indium oxidation at various solder refl...
متن کاملTitle of Dissertation: INFLUENCE OF CRYOGENIC TEMPERATURE AND MICROSTRUCTURE ON FATIGUE FAILURE OF INDIUM SOLDER JOINT
Title of Dissertation: INFLUENCE OF CRYOGENIC TEMPERATURE AND MICROSTRUCTURE ON FATIGUE FAILURE OF INDIUM SOLDER JOINT Rui Wu Chang, Doctor of Philosophy, 2008 Dissertation directed by: Associate Professor F. Patrick McCluskey Department of Mechanical Engineering This thesis aims to develop a fundamental understanding of the underlying mechanisms that govern indium attach degradation in applica...
متن کاملElectromigration in Solder Joints and Solder Lines
Au (0.05 μm) 69.4 μm Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead...
متن کاملIndium Exposure Concentration and Serum Indium Level
The aim of this study was to assess the relationship between indium exposure concentration in the respirable dust fraction (In-E) and indium in serum (In-S) in workers. Methods: A total of 39 workers were studied. The study subjects were categorized into 3 groups, namely, smelting workers (n=7), ITO workers (n=6) in an ITO grinding plant, and other workers (n=26). In-E and In-S ranged from 0.00...
متن کاملStacked solder bumping technology for improved solder joint reliability
Reliability in flip chip and Ball Grid Array is a major concern. Solder joint geometry is extremely important from a reliability point of view. Commonly, the flip chip solder bump takes on the shape of a spherical segment. Mathematical calculations and finite element modeling have shown that the hourglass-shaped solder bumps experience the lowest plastic strain and have the longest lifetime. In...
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ژورنال
عنوان ژورنال: Microscopy and Microanalysis
سال: 2006
ISSN: 1431-9276,1435-8115
DOI: 10.1017/s1431927606066049