In Situ Device‐Level TEM Characterization Based on Ultra‐Flexible Multilayer MoS<sub>2</sub> Micro‐Cantilever (Adv. Mater. 28/2023)

نویسندگان

چکیده

TEM Cantilever Chips In article number 2301439, Chaojian Hou, Jing Zhao, Lixin Dong, and co-workers report a cantilever chip for in situ transmission electron microscopy (TEM). The consists of MoS2 opto-electromechanical sensor plasmonic antenna array built on the top Si3N4 cantilever, forming an electron-beam-transparent (thickness ≈100 nm) nano-opto-electromechanical system (NOEMS), enabling calibration/characterization NOEMS or another device, with serving as to correlate physical properties atomic structures.

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ژورنال

عنوان ژورنال: Advanced Materials

سال: 2023

ISSN: ['1521-4095', '0935-9648']

DOI: https://doi.org/10.1002/adma.202370199