Impact of surface texture on ultrasonic wire bonding process

Due to the complex mechanisms, ultrasonic (US) wire bonding process is usually optimized in way of varying processing parameters including normal force, US power, and time. In this study, a new by creating different surface textures on substrates was used alter improvements were detected. Three deposited strips, straight ditches at angles, elliptic designed created glass substrates. The results showed that hardly influence while strips significantly process. help break oxide scale facilitate transportation oxides outside contact. With ditches, removal efficiency enhanced. Especially when driving current exceeded 0.45 A, long chips from clearly observed during aluminum which continuously cut wire, accumulated pressed squeezed angle shape footprint can be changed correspondingly. Compared smooth surfaces, strength with few times higher had smaller deviation. window enlarged.