High Temperature Microelectromechanical Systems Using Piezoelectric Aluminum Nitride
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
سال: 2014
ISSN: 2380-4491
DOI: 10.4071/hitec-ta24