High-Temperature Electronics Packaging for Simulated Venus Condition
نویسندگان
چکیده
منابع مشابه
High Temperature Electronics Packaging
Materials and processes are being developed for packaging of low and medium power, high temperature electronics (up to 500). Ceramic (Al2O3 and AlN) hermetic packages are being used. Die attach techniques based on patterned Au bumps, Au-Si and off-eutectic Au-Sn have been demonstrated. Au thermosonic wire bonding provides a monometallic interconnect system between the die and the package pads. ...
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ژورنال
عنوان ژورنال: Journal of Microelectronics and Electronic Packaging
سال: 2020
ISSN: 1551-4897
DOI: 10.4071/imaps.1115241