High Speed Extrution of Copper and Copper-Zinc Alloys

Electrochemical and Spectroscopic Study of Benzotriazole Films Formed on Copper, Copper-zinc Alloys and Zinc in Chloride Solution

The formation of protective layers on copper, zinc and copper-zinc (Cu-10Zn and Cu-40Zn) alloys at open circuit potential in aerated, near neutral 0.5 M NaCl solution containing benzotriazole (BTA) was studied using potentiodynamic measurements, electrochemical impedance spectroscopy (EIS) and X-ray photoelectron spectroscopy (XPS). The addition of benzotriazole affects the dissolution of the m...

Soldering and brazing of copper and copper alloys

INVESTIGATING THE PHYSICAL AND MECHANICAL PROPERTIES OF HIGH-COPPER AND SILVER DENTAL-FILLING AMALGAM ALLOYS

Abstract: The aim of the present investigation is to study the physical and mechanical characteristics of dental-filling spherical high-copper and silver amalgams and to compare them with a common high-copper domestic unicompositional amalgam. In this study, cylindrical specimens were mechanically condensed according to the ISO 1559:1986 Standard in order to measure the compressive strength, Vi...

Wettability of Brazing Filler Metals on Copper and Copper Alloys

The possibility of alloying can not be avoided at the interface between molten brazing filler metal and base metal in brazing, so the wettability of brazing filler metal can not be easily explained theoretically. We used the original apparatus for wettability test and investigated the relation between the wettability of brazing filler metals of Ag-P-Cu and Ag-Cu-Zn-Cd systems on copper and the ...

Inhibition Mechanisms of Organic Compounds on Copper and Copper Alloys