Hierarchical Process Simulation for Nano-Electronics

Hierarchical Process Simulation for Nano-Electronics

The challenges of computational electronics are considered from the perspective of process simulation. Essential limitations for device scaling posed from a technology point of view are discussed along with many new research opportunities. The key areas considered include: bulk processing, interconnect technology and software engineering for computational electronics.

Nano-conductive Adhesives for Nano-electronics Interconnection

With the phasing out of lead-bearing solders, electrically conductive adhesives (ECAs) have been identified as one of the environmentally friendly alternatives to tin/lead (Sn/Pb) solders in electronics packaging applications. In particular, with the requirements for fine-pitch and high-performance interconnects in advanced packaging, nanoconductive adhesives are becoming more and more importan...

Dynamic Thermal Simulation and Modelling of Micro- and Nano-Electronics

As semiconductor devices continuously get both smaller and faster, a profound analysis of the dynamic (time-dependent) thermal behaviour is becoming more and more important. In this article some basic concepts and numerical methods for thermal characterization in the frequency domain are explained. Two practical examples are given. First a simple model is presented for a small package mounted o...

Molecular and Nano-electronics

Graphene Nano-Ribbon Electronics

We have fabricated graphene nano-ribbon field-effect transistor devices and investigated their electrical properties as a function of ribbon width. Our experiments show that the resistivity of a ribbon increases as its width decreases, indicating the impact of edge states. Analysis of temperature dependent measurements suggests a finite quantum confinement gap opening in narrow ribbons. The ele...