Growth Behavior of Compounds during Reactive Diffusion in the Solid-Cu/Liquid-Sn System
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چکیده
منابع مشابه
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متن کاملKinetics of Solid-State Reactive Diffusion in the (SnNi)/Cu System
The kinetics of the solid-state reactive diffusion between SnNi alloys and pure Cu was experimentally observed to examine effects of addition of Ni into Sn on the growth behavior of compounds at the interconnection between the Sn-base solder and the multilayer Au/Ni/Cu conductor during energization heating. In this experiment, sandwich (SnNi)/Cu/(SnNi) diffusion couples with Ni concentration...
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ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2018
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.mc201712