منابع مشابه
Thermal Stress Resistance to Fracture and its Relation to with Resistance to Thermal Fatigue and Shock
Dense Silicon nitride was investigated to determine the effect of its microstructural parameters and densification on thermo-mechanical properties and thermal stress resistance to fracture initiation during a hot or cold mechanical and thermal shock testing. The different materials and microstructures were obtained by changing the parameters such as the type of the powder, additive, forming p...
متن کاملThermal Stress Resistance to Fracture and its Relation to with Resistance to Thermal Fatigue and Shock
Dense Silicon nitride was investigated to determine the effect of its microstructural parameters and densification on thermo-mechanical properties and thermal stress resistance to fracture initiation during a hot or cold mechanical and thermal shock testing. The different materials and microstructures were obtained by changing the parameters such as the type of the powder, additive, forming p...
متن کاملMajorization properties of generalized thermal distributions
We examine the majorization properties of general thermal-like mixed states depending on a set of parameters. Sufficient conditions which ensure the increase in mixedness, and hence of any associated entropic form, when these parameters are varied, are identified. We then discuss those exhibiting a power law distribution, showing that they can be characterized by two distinct mixing parameters,...
متن کاملEffective Thermal Conductivity of Graded Nanocomposites with Interfacial Thermal Resistance
This work employs the self-consistent method to investigate the effective thermal conductivity distribution in functionally graded materials (FGMs) considering the Kapitza interfacial thermal resistance. A heat conduction solution is first derived for one spherical particle embedded in a graded matrix with a prefect interface. The interfacial thermal resistance of a nanoparticle is simulated by...
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ژورنال
عنوان ژورنال: Quarterly of Applied Mathematics
سال: 1961
ISSN: 0033-569X,1552-4485
DOI: 10.1090/qam/121074