Full Wave Simulation and Design of Film Bulk Acoustic Wave Filters
نویسندگان
چکیده
منابع مشابه
Thin film bulk acoustic wave resonators: a technology overview
This paper describes a high quality thin film piezoelectric aluminium nitride technology developed for applications in bulk acoustic wave resonators and filters. The fabrication of both SMR and FBAR resonators is described, and the main characteristics of these devices are reviewed.
متن کاملFerroelectric film bulk acoustic wave resonators for liquid viscosity sensing
A concept of accurate liquid viscosity sensing, using bulk acoustic wave (BAW) resonators, is proposed. The proposed BAW resonators use thin ferroelectric films with the dc field induced piezoelectric effect allowing for generation of pure longitudinal acoustic waves in the thickness excitation mode. This makes it possible to utilize exclusively shear liquid particle displacement at the resonat...
متن کاملFilm bulk acoustic-wave resonator based ultraviolet sensor
This letter described ultraviolet UV radiation sensing with ZnO based film bulk acoustic-wave resonator FBAR . The resonant frequency upshifted when there was UV illumination on the FBAR. For 365 nm UV light, the frequency upshift was 9.8 kHz with an intensity of 600 W /cm2, and the detection limit of the sensor was 6.5 nW. The frequency increase in the FBAR UV sensor was proposed to be due to ...
متن کاملApplications of Surface Acoustic and Shallow Bulk Acoustic Wave Devices
Applications of surface acoustic wave (SA W) and shallow bulk acoustic wave (SBA W) devices are reviewed. SA W-device coverage includes delay lines and filters operating at selected frequencies in the range from about 10 MHz to 11 GHz, modeling with singlecrystal piezoelectrics and layered structures, resonators and lowloss filters, comb filters and multiplexers, antenna duplexers, harmonic dev...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: MATEC Web of Conferences
سال: 2018
ISSN: 2261-236X
DOI: 10.1051/matecconf/201816001005