منابع مشابه
From the EIC: Manufacturing test woes
WITH THE MANUFACTURING CAPACITY of thousands of wafers per week, and thousands of dies per wafer, today's silicon comes out of fab really fast—and furious—sporting device I/Os in the gigabit-per-second range. But it is increasingly going into high-volume and low-cost consumer electronic parts, exhausting the available time and money to test these parts. Little wonder that the 2003 International...
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ژورنال
عنوان ژورنال: IEEE Design & Test
سال: 2019
ISSN: 2168-2356,2168-2364
DOI: 10.1109/mdat.2019.2934857