Experimental parameter identification and validation of a process model for ultrasonic heavy wire bonding

Abstract Ultrasonic heavy wire bonding is a standard process in packaging technologies of power semiconductor modules. Due to increasing demands on reliability the electrical contacts under high temperature loads, copper wires with significantly better and thermal properties compared aluminum are used more often nowadays. This results new challenges development due higher forces ultrasonic power; for this purpose, simulation model has been developed improve development. The based co-simulation sub-models different physical phenomena. parameters, which need be identified from measurements. contribution focusses identification material model. Therefore, method presented, allows an iterative stress-strain characteristics compression tests modified tensile-compression machine. In load, bond behavior load investigated characterize so-called ultrasonic-softening-effect. parameters then predict main-effects-diagrams processes DCB. validated by comparison parameter studies experiments.