Experimental investigations on optimizing manufacturing parameters for electrospark deposition diamond wire saw

The third generation of superhard semiconductor materials, represented by single-crystal SiC, is used widely in microelectronics due to their excellent physical and mechanical properties. However, high hardness brittleness have become bottlenecks development. A diamond wire saw (DWS) has the mainstream tool for sawing hard brittle crystal materials. abrasive consolidated on core through resin or electroplated nickel, holding strength not high. When efficiency low. To improve it great significance wear resistance particles. Electrospark deposition (ESD) can deposit electrode materials substrate with low heat input achieve metallurgical bonding between metal It effectively gripping grains. ability make DWS ESD process. In this paper, equipment was designed according characteristics ESDDWS discharge gap size consumption are monitored real time a single-chip microcomputer (SCM). Orthogonal experiments were carried out two motion modes. effects process parameters, such as (A) grain size, (B) content, (C) pulse duration time, (D) compacting pressure, (E) current, (F) diameter, (G) interval (H) reciprocating times, (I) feed speed, quality analyzed. Through extreme difference analysis (EDA), optimal parameter combinations obtained. mode 1, combination W10, content 1 wt%, 20 ?s, pressure 400 MPa, current 19 A, diameter 3 mm, 2 ms obtain value number points protrusion particles at same time. sequence manufacturing parameters affecting indicators F > G E B D C. 2, W40, 4 300 23 times speed mm/step C I H A.