Evaluating Techniques for Joining Piezo-Electric Elements on Test Structures for Performing Vibration-Based Measurement Methods

When performing vibration-based measurement techniques, e.g., for structural health monitoring, piezo-electric elements are often used as the sensor and/or actuator part due to their durability. The connection between element and test structure plays a decisive role in quality of results obtained process. In addition stable mode-independent vibration transmission, further requirements such reversibility or temperature resistance can be imposed depending on application. many preliminary studies, bonding by means two-component epoxy resin was practically simulatively validated large amount use cases. Nevertheless, limited preparation time adhesion process limit flexibility method. aim this work is evaluate different joining technologies metal polymer substrates, especially with respect reversibility. Different techniques piezo collected, considering previous well newly developed approaches within scope work. next step, frequency spectra simple circular blanks using an EMI setup joined appropriate technique. Joining considered reference All evaluated, based degree reversibility, transmission quality, effort implementation durability, comparison Finally, recommendations regarding proper technique experimental conditions given results.