Epoxy-based composites with enhanced thermal properties through collective effect of different particle size fillers

Taking advantages of excellent adhesion and insulating properties, polymer-based thermal interface materials have been widely used in electrical electronic industry. However, applications was limited due to the existence high interfacial resistance poor mechanical properties resulted from dispersion weak conductive fillers polymer matrix. Herein, different sizes aluminum oxide microparticle as fabricate a series epoxy composites, effect loading ratio on conductive, mechanical, stability further analyzed. The optimum composite exhibits conductivity (1.91 ± 0.02 W·m −1 ·K ) at 1: 2 (20-μm: 70-μm, mass ratio), which is equivalent enhancement 950% comparison with pure resin. outstanding as-prepared mainly attributed effective network formed by size that smaller particles act bridge connect larger one. This work has proved Agari model combining Al O 3 workable way obtain it expected provide reliable route for preparation thermally composites particle sizes.