Environment Administration and Substitute Technology. Tin-Silver Alloy Plating from Non-Cyanide Bath.
نویسندگان
چکیده
منابع مشابه
Mirror-Bright Silver Plating from a Cyanide-Free Bath
ilver has good electric conductivity and solderability and possesses S excellent electric characteristics as a contact and is thus widely used for plating electronic industrial parts. A cyanide plating bath is most often used, but the cyanide compounds have strong toxicity and a large amount of the cost is rxpkd for securing safe working conditions and waste treatment. Because of this, many cya...
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Cyanide silver solution containing 200 to 1000 mg L silver ions were used for recovery studies. The nature of the silver deposit was studied using a Hull cell, and the current density range was selected for electrolysis to recover silver. A batch electrochemical reactor, consisting of a planar stainless steel cathode and platinum anode was used and silver was recovered at 0?04 to 0?2 A dm. The ...
متن کاملFormation of Au Microbump Arrays for Flip-Chip Bonding Using Electroless Au Deposition from a Non-Cyanide Plating Bath
The formation of Au microbump arrays for flip-chip bonding was investigated using an electroless Au plating bath. Generally, electroless Au deposition gives a low deposition rate, preventing the fabrication of Au bumps with heights of more than 5 μm. To overcome this problem, we developed a new electroless Au deposition process that employs a non-cyanide bath. This process delivers a high depos...
متن کاملDECORATIVE CHROMIUM and CADMIUM SUBSTITUTES
Although alloy tin plating has been known and used for many years, this paper will describe the use of a new non-cyanide tin/zinc alloy as a possible replacement coating for cadmium and the use of a tin/nickel alloy as a possible substitute for barrel decorative chromium plating. A review on the corrosion properties of tin, zinc and cadmium compared to tin/zinc alloys and review of the properti...
متن کاملElectroless Nickel Plating: Bath Control
In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) – thickness of the plating film and phosphorous content – are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nic...
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ژورنال
عنوان ژورنال: Journal of the Surface Finishing Society of Japan
سال: 1998
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.49.230