Electrical Property Improvement of Copper Filler Conductive Adhesive with Low-Melting Point Metal Bridge

Conductive Copper-PMMA Nanocomposites: Microstructure, Electrical Behavior, and Percolation Threshold as a Function of Metal Filler Concentration

The copper-PMMA conductive composites were manufactured using different copper concentrations dispersed into the polymeric matrix by hot compression molding in inert atmosphere. The PMMA matrix was analyzed using dilute solution viscosimetry analysis and it did not evidence degradation in its molecular weight. The microstructure was examined by means of SEM and the electric conductivity was mea...

Low energy structural dynamics and constrained libration of Li(NH3)4, the lowest melting point metal.

The lattice and molecular dynamics for the solid phases of the lowest melting-point metal, Li(NH3)4, are determined by incoherent inelastic neutron scattering. Measurements of internal molecular displacements and distortions of the Li(NH3)4 units have been modelled and assigned using density functional theory calculations for the solid and molecular system. Inelastic neutron scattering measurem...

Experimental study of the of the thermo-regulating property of clothing system contained different melting point microencapsulated PCMs

Effects of Silane Coupling Agents on the Properties of Copper Filled Electrically Conductive Adhesive

Effects of silane coupling agents with different functional groups such as epoxy, isocyanate and ureide on the electrical and mechanical properties of copper filled electrical conductive adhesives (ECAs) were studied. Copper (Cu) fillers were used as conductive fillers and polyurethane resin was applied as the adhesive material in this study. Significant differences could be observed on the as ...

Synthesis and electrical property of metal/ZnO coaxial nanocables

Ag/ZnO and Cu/ZnO coaxial nanocables were fabricated using AgNO3 or copper foil as source materials by the vapor-liquid-solid process. The coaxial nanocables consist of a crystalline metallic Ag or Cu core and a semiconductor ZnO shell. The evolution of the Ag/ZnO products having different morphologies was investigated by stopping the heating at different temperatures. The diameters of the Ag/Z...