Effects of Wafer Warpage on the Misalignment in Wafer Level Stacking Process
نویسندگان
چکیده
منابع مشابه
Wafer Cut and Rotation for Compound Yield Improvement in 3D Wafer-on-Wafer Stacking
Three-dimensional IC (3D IC) exhibits various advantages over traditional two-dimensional IC (2D IC), including heterogeneous integration, reduced delay and power dissipation, smaller chip area, etc. Wafer-on-wafer stacking is most attractive for 3D IC fabrication, but it suffers from low compound yield. To improve the compound yield, two efforts have been done in this work. First, a hybrid waf...
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ژورنال
عنوان ژورنال: Journal of the Microelectronics and Packaging Society
سال: 2013
ISSN: 1226-9360
DOI: 10.6117/kmeps.2013.20.3.071