Diffusion of Palladium on Tantalum Microcrystal

Tantalum-based Diffusion Barriers for Copper Metallization

Tantalum Carbide and Nitride Diffusion Barriers for Cu Metallisation

The reactions in the Si/TaC/Cu and Si/Ta2N/Cu metallisation systems were investigated by x-ray diffraction, Rutherford backscattering, scanning electron microscope and the transmission electron microscopy. The results were then combined with the assessed ternary SiTa-C, Ta-C-Cu, Si-Ta-N and Ta-N-Cu phase diagrams. It was found that both barriers ultimately failed due to diffusion of Cu through ...

Tantalum-based diffusion barriers in Si/Cu VLSI metallizations

We have studied sputter-deposited Ta, Ta s6 ‘t4, and Ta3&ir4N~e thin lilms as diffusion Sr barriers between Cu overlayers and Si substrates. Electrical measurements on Si n +p shallow junction diodes demonstrate that a 180-nm-thick Ta film is not an effective diffusion barrier. For the standard test of 30-min annealing in vacuum applied in the present study, the Ta barrier fails after annealing...

Palladium Alloys for Hydrogen Diffusion Membranes

Palladium holds a unique position among the metallic elements in being able to take into solution large quantities of hydrogen while simultaneously retaining a high degree of ductility. These attributes coupled with the high mobility or rate of diffusion of hydrogen in the lattice have been exploited in the use of palladium and subsequently of palladiumbased alloys as hydrogen diffusion membran...

Microcrystal manipulation with laser tweezers

X-ray crystallography is the method of choice to deduce atomic resolution structural information from macromolecules. In recent years, significant investments in structural genomics initiatives have been undertaken to automate all steps in X-ray crystallography from protein expression to structure solution. Robotic systems are widely used to prepare crystallization screens and change samples on...