Development of 'ECOBRASS' Lead-free Copper Alloy.
نویسندگان
چکیده
منابع مشابه
Comparison of thermo-mechanical behavior of lead-free copper and tin-lead column grid array packages
Thermo-mechanical behavior of the lead (Pb)-free ceramic copper column grid array (CuCGA) package under accelerated thermal cycling is characterized and compared with the conventional tin–lead (Sn–Pb) ceramic column grid array (CCGA). In situ thermal deformations of the highest DNP (distance to neutral point) copper column is measured for an initial isothermal loading of DT = 75 C and subsequen...
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ژورنال
عنوان ژورنال: Materia Japan
سال: 2000
ISSN: 1340-2625,1884-5843
DOI: 10.2320/materia.39.90