Design, modeling and parametric optimization of thermoelectric cooling systems for high power density electronic devices

نویسندگان

چکیده

Abstract The present article reports on the design, modeling and parametric optimization of a thermoelectric cooling system for electronics applications. An analytical model based energy equilibrium is developed microprocessor using module with an air-cooled finned heat sink. proposed validated by experimental measurements comparison detailed 3D numerical simulations. Estimation effective material properties manufacturer-reported performance characteristics found to reduce uncertainty in calculation input power as compared measurements. A sink carried out maximize coefficient (COP) achieve required capacity microprocessor. effectiveness methodology demonstrated current high microprocessors. At constant current, COP increase increasing geometric ratio. Furthermore, at ratio, increases reach maximum value then decreases. study highlights importance designing fabricating high-performance cooler modules optimum parameters specific electronic components. results indicate that can be increased ~70% optimized non-optimized commercially available modules.

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ژورنال

عنوان ژورنال: International Journal of Low-carbon Technologies

سال: 2021

ISSN: ['1748-1325', '1748-1317']

DOI: https://doi.org/10.1093/ijlct/ctab032