Deep sub-micron stud-via technology for superconductor VLSI circuits
نویسندگان
چکیده
منابع مشابه
Deep sub-micron stud-via technology for superconductor VLSI circuits
A fabrication process has been developed for fully planarized Nb-based superconducting inter-layer connections (vias) with minimum size down to 250 nm for superconductor very large scale integrated (VLSI) circuits with 8 and 10 superconducting layers on 200-mm wafers. Instead of single Nb wiring layers, it utilizes Nb/Al/Nb trilayers for each wiring layer to form Nb pillars (studs) providing ve...
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ژورنال
عنوان ژورنال: Journal of Physics: Conference Series
سال: 2014
ISSN: 1742-6596
DOI: 10.1088/1742-6596/507/4/042043