Cu Metallization of Al2O3 Ceramic by Coating Deposition from Cooled- and Hot-Target Magnetrons

We examined the feasibility of alumina substrate metallization by magnetron deposition copper coatings with thickness several tens µm for its prospective applications in production ceramic PCBs and packaging. The films were prepared sputtering systems cooled thermally insulated (hot) targets. Substrates different geometries used, including those through-holes. Thickness, adhesive properties, electrical resistivity produced analyzed. If film exceeded ~20 µm, we observed systematic delamination, unless dedicated CuxOy sub-layer was introduced between main Cu film. Intermediate oxide investigated separately SEM, EDS, XRD methods, conditions predominant growth favorable tenorite CuO determined. Prepared composite two-layer + total ~100 demonstrated good adhesion to substrates scratch-testing performed much better than Cu-only both soldering thermal cycling tests. discuss an approach constructing a reliable metallizing coating plasma-assisted PVD methods that could be beneficial complex-shaped