CSP Technology and High Aspect Ratio Bumps.

نویسندگان
چکیده

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

High aspect-ratio polysilicon micromachining technology

This paper presents a single wafer, all-silicon, high aspect-ratio multi-layer polysilicon micromachining technology that combines deep dry etching of silicon with conventional surface micromachining to realize tens to hundreds of microns thick, high aspect-ratio, electrically isolated polysilicon structures with sub-micron air-gaps. Vertical polysilicon sense electrodes as tall as the main bod...

متن کامل

Maskless shaping of gold stud bumps as high aspect ratio microstructures

Micro/nanoimprinting is a simple and economical way of patterning polymeric structures over large areas. This paper seeks to extend this technique to fabricate three dimensional (3D) metallic microstructures, even in trenches and constrained areas using a flip chip bonder in conjunction with a wire bonder. In this two step process, gold stud bumps were placed first on sputtered metal at appropr...

متن کامل

Approaches to High Aspect Ratio Triangulations

In aerospace computational uid dynamics calculations, high aspect ratio, or stretched, triangulations are often used to adequately resolve the features of a viscous ow around bodies. In this paper, we explore alternatives to the Delaunay triangulation which can be used to generate high aspect ratio triangulations of point sets. The method is based on a variation of the lifting map concept which...

متن کامل

High-aspect-ratio bulk micromachining of titanium.

Recent process developments have permitted the highly anisotropic bulk micromachining of titanium microelectromechanical systems (MEMS). By using the metal anisotropic reactive ion etching with oxidation (MARIO) process, arbitrarily high-aspect-ratio structures with straight sidewalls and micrometre-scale features have been bulk micromachined into titanium substrates of various thicknesses, ran...

متن کامل

High Aspect Ratio Si Etching in STS2

Deep reactive ion etching (DRIE) is one of the most important etching techniques because it is independent of crystal orientation and does not require any wet process. DRIE can be applied for many applications. For examples, this technique can be used to fabricate MEMS devices (e.g. accelerometers, scanners, etc.), microfluidic devices, electrical through wafer interconnects, and so on. In many...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Journal of Japan Institute of Electronics Packaging

سال: 1999

ISSN: 1343-9677,1884-121X

DOI: 10.5104/jiep.2.35