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A Creep Model for Solder Alloys
Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where dislocation motion and diffusion processes are taken into account. In this study, most commonly used creep models are compared with the...
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ژورنال
عنوان ژورنال: Nature
سال: 1951
ISSN: 0028-0836,1476-4687
DOI: 10.1038/167836a0