Copper Materials for Low Temperature Sintering

In this review paper, recent studies on low-temperature sintering strategies of copper materials for conductive layer preparation have been summarized. Coinage metals, gold, silver, and used as inks pastes printed electronics. Copper is a highly electrically thermally material that can be in electronic circuits die-attach materials. Recently, copper-based inks/pastes gained significant attention researchers industries However, readily oxidized under air, especially, at the nanoscale, particles may catch fire because rapid oxidization. To overcome issue, nanoparticles fine are coated with organic molecules which act insulators after sintering. Some interesting surface treatments or activation investigated regard. different perspectives applications presented.