Comparison in sintered silver die attach failure between thermal shocked test and mechanical cycling test

Abstract This paper compares the degradation of sintered silver (s-Ag) die attach between thermal shocked test (TST) and mechanical cycling to correctly understand mechanism s-Ag failure in power module products during practical operation. A bar-shaped specimen is subjected two types four-point bending tests: centered (CBT) for moment application shifted (SBT) shear force application. crack path SBT like that TST, which suggests has an important role imitating TST. propagation speed per cycle TST is, however, about 4,000 times faster than SBT. The lifetime assessment period approximately 1,400 shorter difference discussed by scanning electron microscopy (SEM) fractured specimens.