Cold sintering of microwave dielectric ceramics and devices

Abstract Microwave (MW) dielectric ceramics are used in numerous electronic components for modern wireless communication systems, including antennas, resonators, capacitors and filters. However, to date, MW manufactured by an energy-intensive, conventional high-temperature (> 1000 °C) sintering technology thus cannot be co-sintered with low melting point base electrodes (Ag, Al, etc., < °C), nor directly integrated polymers (< 200 °C). Cold is able densify at °C via a combination of external pressure transient liquid phase, reducing the energy consumed facilitating greater integration dissimilar materials. This review outlines basics alongside mechanism cold sintering. Recent developments ceramics, composites devices described, emphasizing new materials progress towards component/device fabrication. Future prospects critical issues advancing cold-sintered devices, such as unclear mechanism, Q × f values poor mechanical properties, discussed. Graphic abstract