Closed-Form Solution for Thermo-Elastoplastic Strains in Semiconductor Chip Bonding Structures

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ژورنال

عنوان ژورنال: JSME international journal. Ser. A, Mechanics and material engineering

سال: 1993

ISSN: 1340-8046

DOI: 10.1299/jsmea1993.36.4_374