منابع مشابه
Semiconductor Packaging Assembly Technology
This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...
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In order to evaluate present and future retail packaging systems, it is necessary to review past fresh red meat (FRM) packaging systems. Prior to 1967, whole beef carcass shipments were traditionally made to retail outlets where carcasses were fabricated into retail items by butchers in individual stores. The "boxed beef" concept was introduced in 1967, dramatically changing beef processing, di...
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The authorities in Modena hope the bats can stop the onslaught of the tiger mosquito. Council workers place the bat boxes in quiet, dark, south-facing sites that bats prefer for breeding in the early months of the year. “We are trying to think of what we could do to exploit their natural predators and so we thought of bats,” says Modena’s environment councillor Simona Arletti. “Until now the me...
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The purpose of food packaging is to preserve the quality and safety of the food it contains from the time of manufacture to the time it is used by the consumer. Recently, the demand for safe and high quality foods, as well as changes in consumer preferences have led to the development of innovative and novel approaches in food packaging technology. One such development is the active food packag...
متن کاملPower Supply and Current Modulation Circuits for Semiconductor Lasers
Design and construction of a stable current supply with protection circuits are described. The reported circuit provides a high-stable and high-level current variable from 0.5-1.2 A with the protect ion circuits to prevent over load current, voltage and off-range temperature operation. A detailed analysis of the circuit parameters is given and the time behaviors of the load voltage/current and ...
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ژورنال
عنوان ژورنال: Laser Technik Journal
سال: 2018
ISSN: 1613-7728
DOI: 10.1002/latj.201800001