Clean Technology Supporting Semiconductor Manufacturing Process. Wafer Cleaning Technology.
نویسندگان
چکیده
منابع مشابه
The Evolution of Silicon Wafer Cleaning Technology
The purity of wafer surfaces is an essential requisite for the successful fabrication of VLSI and ULSI silicon circuits. Wafer cleaning chemistry has remained essentially unchanged in the past 25 years and is based on hot alkaline and acidic hydrogen peroxide solutions, a process known as "RCA Standard Clean." This is still the primary method used in the industry. What has changed is its implem...
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Photolithography is the engine that empowered semiconductor industry to reduce the minimum feature size of the components of a microchip from some 50 microns in the 1960s to below 14 nanometers today. Diffractive and refractive micro-optical components play a decisive role in modern photolithography systems, e.g. for laser line width narrowing, laser beam shaping (customized illumination), as p...
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The use of wafer inspection systems in managing semiconductor manufacturing yields is described. These systems now detect defects of size as small as 40 nm. Some high-speed systems have achieved 200-mm diameter wafer throughputs of 150 wafers per hour. The particular technologies involved are presented. Extensions of these technologies to meet the requirements of manufacturing integrated circui...
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Wire saw, with its ability to cut very thin wafers from large diameter crystalline ingots of semiconductor materials, has emerged as a leading technology for wafer production in semiconductor and photovoltaic industry. Nevertheless, the wire saw cutting process remains lacking a theoretical methodology and is not properly understood. The modern times compulsion of more accurate and efficient ma...
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In this paper, we report on the removal of photoresist, post-etch process residues and particles for various patterned semiconductor wafers using supercritical carbon dioxide (SCCO2)/chemical modifier formulations. Optimization of the chemical formulations was determined using data obtained from statistical analysis and designed experiments. Characterization of the processed samples via scannin...
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ژورنال
عنوان ژورنال: Journal of the Surface Finishing Society of Japan
سال: 1999
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.50.861