Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips
نویسندگان
چکیده
منابع مشابه
Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips
Sintering of nanosilver paste has been extensively studied as a lead-free die-attach solution for bonding semiconductor power chips, such as the power insulated gated bipolar transistor (IGBT). However, for the traditional method of bonding IGBT chips, an external pressure of a few MPa is reported necessary for the sintering time of ~1 h. In order to shorten the processing duration time, we dev...
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ژورنال
عنوان ژورنال: Materials
سال: 2016
ISSN: 1996-1944
DOI: 10.3390/ma9070564