Can Advanced Work Packaging Become a Lean Method?
نویسندگان
چکیده
منابع مشابه
Advanced Module Packaging Method
Abstract An intermediate solution between conventional printed circuit board technology and wafer level packaging, WLP, is to fabricate interconnection circuits and flip chip assembly structures on large glass substrates using LCD manufacturing equipment. Trace widths of 5 microns and a trace pitch of 10 microns are achievable on flexible substrates as large as 1800 x 1500 mm. Back planes for d...
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ژورنال
عنوان ژورنال: Annual Conference of the International Group for Lean Construction
سال: 2023
ISSN: ['2789-0015', '2309-0979']
DOI: https://doi.org/10.24928/2023/0129