Built-on Machine (Hybrid Wire EDM)

نویسندگان

چکیده

منابع مشابه

Modeling and Optimization of Wire EDM Process

The present work is aimed to optimize the parameters of (WEDM) process by considering the effect of input parameters viz. Time On, Time Off, Wire Speed & Wire Feed. Experiments have been conducted with these parameters in three different levels data related to process responses viz. Metal removal rate, surface roughness (Ra) have been measured for each of the experimental run. These data have b...

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Wire electro discharge machining (WEDM) has become one of the most popular processes for producing precise geometries in hard materials, such as those used in the tooling industry. Since it is recognized as a precision process, optimization of different aspects related to dimensional accuracy is a classic research topic. The so-called tapercutting involves the generation of inclined ruled surfa...

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Wire Edm Machining Simulations Based on Step-nc Program

Preliminary notes This paper presents the possibilities of applying a new method of programming based on STEP-NC standards, which was developed as an alternative to the G code. The possibilities of application in the field of machining simulation and verification of the program before machining on the wire electrical discharge machine are discussed. The paper shows the possible methodology for ...

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Research on Fuzzy Control Method in EDM Machine

Processing effect is a lot of. In this paper, the research perspective is to improve the machining efficiency and machining quality of the system. Based on the analysis of the characteristics of the edm process as the foundation, proposed a fuzzy control technology. In edm process, using fuzzy neural network control technology. According to the characteristics of the fuzzy controller, combined ...

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Development of Multi-wire Edm Slicing Method for Silicon Ingot

INSTRUCTIONS The diameter of silicon wafer becomes larger in order to increase the number of chips per one wafer. For such a larger diameter silicon ingot is mainly sliced by using multi-wire method, in which a long thin wire is used with slurry. In this method, several hundreds of wafers could be sliced at the same time. However there are still problems remained, such as large cracks, slurry t...

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ژورنال

عنوان ژورنال: Journal of the Japan Society for Precision Engineering

سال: 2008

ISSN: 1882-675X,0912-0289

DOI: 10.2493/jjspe.74.333